FI-X30SSLA-HF_JE

JAE, FI-X 1mm Pitch 30 Way 1 Row Right Angle PCB Socket, Surface Mount, Solder Termination

Atlas

These Amphenol DIP TMM Micro. Match 1.27 mm pitch range of female Headers allow Board to Board or Wire to Board connections. When mated with the appropriate TMM Micro. Match male Header (see stock number 739-1091 typical) they provide a ...

These Amphenol DIP TMM Micro. Match 1.27 mm

Amphenol ICC, TMM 1.27mm Pitch 10 Way 2

SC to ST duplex adapter with a beige plastic housing and a metal alignment sleeve and stainless steel retention clip. Includes black plastic protective caps and covers. The SC to ST duplex adapter has a recommended panel cut out size ...

TE Connectivity 4mm Pitch 2 Way 1 Row

The Samtec SSW series consist of through hole SQ post socket. It has Tiger Buy™ contact system whereas it is having phosphor bronze contact material. Current rating:4.7A per pin(2 pins powered)Normal force: standard= 125grams (4.4N)Max cycles:100 with 10μ" (0.25μm) Voltage ...

The Samtec SSW series consist of through hole

Samtec, SSW 2.54mm Pitch 8 Way 1 Row

A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications. Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards. Suitable for LAN, WAN, telecommunication, ...

A range of 1.00mm Pitch Mezzanine IEEE 1386

units	Per unit	Per Pack*
5 - 95	$33.37	$166.85
100 - 370	$32.782	$163.91
375 - 1495	$31.336	$156.68
1500 - 2995	$29.548	$147.74
3000 +	$28.496	$142.48
*price indicative

Attribute	Value
Number of Contacts	30
Number of Rows	1
Pitch	1mm
Type	Wire to Board
Mounting Type	Surface Mount
Body Orientation	Right Angle
Termination Method	Solder
Current Rating	12A
Voltage Rating	200 V ac/dc
Series	FI-X
Contact Material	Copper

JAE, FI-X 1mm Pitch 30 Way 1 Row Right Angle PCB Socket, Surface Mount, Solder Termination

90° LVDS Header

Related Products

Related Items

Related Categories