The properties of silicon carbide (SiC) distinguish it from pure silicon due to its unique atomic structure. While silicon forms bonds with four adjacent silicon atoms in a basic grid, silicon bonded with carbon creates tightly packed tetrahedrons consisting of four carbon atoms with a silicon atom in the middle. This crystalline structure maximizes power density, efficiency, and reliability.
Thermal Conductivity
Thermal conductivity measures how effectively heat can traverse through a material, a critical property for semiconductors. It indicates how efficiently materials dissipate heat, crucial for managing voltage and current capacities as power increases with higher currents.
Silicon's thermal conductivity of 130 W/(m⋅K) pales in comparison to silicon carbide's impressive 490 W/(m⋅K). This superior thermal conductivity enables silicon carbide semiconductors to efficiently dissipate heat from higher operating voltages.
Thermal Expansion
Thermal expansion occurs when a material changes its shape or size due to temperature fluctuations without changing phase. Silicon carbide boasts a relatively low coefficient of thermal expansion, allowing it to maintain its shape, strength, and performance at higher temperatures and voltages better than silicon.
Electric Field Strength
Two crucial semiconductor properties, closely related to each other, are the material's band gap and maximum electric field strength.
In semiconductor materials, electrons transition between different energy bands. The band gap represents the energy required for electrons to move from the valence band to the conduction band, facilitating electrical conductivity. When semiconductors receive electrical energy and enter this conductive state, they showcase their unique insulator/conductor hybrid nature.
Silicon carbide semiconductors possess an energy gap three times higher than silicon-based ones, enabling them to withstand higher electric field strengths and operate at elevated voltages and temperatures.