Fischer Elektronik Heatsink, Universal Round Alu, 5.6°C/W 20 mm
- RS Stock No.:
- 674-4844
- Mfr. Part No.:
- ICK S R 32,5x20
- Brand:
- Fischer Elektronik
Subtotal (1 unit)*
$25.42
(exc. GST)
$29.23
(inc. GST)
FREE delivery for orders over $60.00 ex GST
- Plus 61 left, shipping from 02 February 2026
Units | Per unit |
|---|---|
| 1 - 49 | $25.42 |
| 50 - 99 | $24.65 |
| 100 - 249 | $23.68 |
| 250 + | $22.92 |
*price indicative
- RS Stock No.:
- 674-4844
- Mfr. Part No.:
- ICK S R 32,5x20
- Brand:
- Fischer Elektronik
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Round Alu | |
| Height | 20mm | |
| Thermal Resistance | 5.6°C/W | |
| Fastening | Conductive Foil | |
| Diameter | 32.5 mm | |
| Finish | Black Anodised | |
| Compatible Package Type | LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD | |
| Special Features | Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Round Alu | ||
Height 20mm | ||
Thermal Resistance 5.6°C/W | ||
Fastening Conductive Foil | ||
Diameter 32.5 mm | ||
Finish Black Anodised | ||
Compatible Package Type LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD | ||
Special Features Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings | ||
- COO (Country of Origin):
- DE

ICK S R Series
PGA Heatsinks
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