Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, PLCC to PGA
- RS Stock No.:
- 741-9344
- Mfr. Part No.:
- WA044127DAJTRC
- Brand:
- Winslow
This image is representative of the product range
Bulk discount available
Subtotal (1 unit)*
$36.79
(exc. GST)
$42.31
(inc. GST)
FREE delivery for orders over $60.00 ex GST
In Stock
- 17 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 24 | $36.79 |
| 25 - 99 | $36.16 |
| 100 + | $34.63 |
*price indicative
- RS Stock No.:
- 741-9344
- Mfr. Part No.:
- WA044127DAJTRC
- Brand:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | PLCC | |
| Connection Gender A | Female | |
| Number of Contacts A | 44 | |
| Connection Gender B | Male | |
| Number of Contacts B | 44 | |
| Pitch | 2.54mm | |
| Series | WAxx127DAJT / WAxx127DSAJT | |
| Contact Plating | Tin over Nickel | |
| Connection B | PGA | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A PLCC | ||
Connection Gender A Female | ||
Number of Contacts A 44 | ||
Connection Gender B Male | ||
Number of Contacts B 44 | ||
Pitch 2.54mm | ||
Series WAxx127DAJT / WAxx127DSAJT | ||
Contact Plating Tin over Nickel | ||
Connection B PGA | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
PLCC Pads to PGA Pin Adapters
These Winslow Adaptics PLCC with Pads to PGA Pin Adapters have a 1.6mm above board height.
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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