Infineon FF1800R17IP5BPSA1 Dual IGBT, 1.8 kA 1700 V AG-PRIME3+
- RS Stock No.:
- 222-4792P
- Mfr. Part No.:
- FF1800R17IP5BPSA1
- Brand:
- Infineon
Bulk discount available
Subtotal 10 units (supplied in a tray)*
$30,040.80
(exc. GST)
$34,546.90
(inc. GST)
FREE delivery for orders over $60.00 ex GST
In Stock
- 4 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 10 - 99 | $3,004.08 |
| 100 - 249 | $2,950.00 |
| 250 - 499 | $2,896.89 |
| 500 + | $2,844.74 |
*price indicative
- RS Stock No.:
- 222-4792P
- Mfr. Part No.:
- FF1800R17IP5BPSA1
- Brand:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current | 1.8 kA | |
| Maximum Collector Emitter Voltage | 1700 V | |
| Maximum Gate Emitter Voltage | 20V | |
| Maximum Power Dissipation | 1.8 kW | |
| Configuration | Dual | |
| Package Type | AG-PRIME3+ | |
| Channel Type | N | |
| Transistor Configuration | Common Emitter | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 1.8 kA | ||
Maximum Collector Emitter Voltage 1700 V | ||
Maximum Gate Emitter Voltage 20V | ||
Maximum Power Dissipation 1.8 kW | ||
Configuration Dual | ||
Package Type AG-PRIME3+ | ||
Channel Type N | ||
Transistor Configuration Common Emitter | ||
The Infineon PrimePACK™3+ 1700 V, 1800 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT soft switching interconnection technology, Emitter Controlled 5 diode and NTC. Also available with pre-applied Thermal Interface Material.
Extended operation temperature (Tvjop= 175°C)
Output current increased by more than 25% in the same footprint
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Package with CTI > 400
Output current increased by more than 25% in the same footprint
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Package with CTI > 400