TDK 22pF MLCC, 50V dc V, ±5pF , SMD
- RS Stock No.:
- 877-5765P
- Mfr. Part No.:
- C0603C0G1H220J030BA
- Brand:
- TDK
Price (ex. GST) Each (Supplied on a Reel)**. Quantities below 150 on continuous strip
$0.125
(exc. GST)
$0.144
(inc. GST)
999999 In stock for delivery within 1 working day(s)*
* Delivery dates may change based on your chosen quantity and delivery address.
FREE delivery for orders over $80 ex GST
Units | Per unit |
---|---|
500 + | $0.125 |
**price indicative
- RS Stock No.:
- 877-5765P
- Mfr. Part No.:
- C0603C0G1H220J030BA
- Brand:
- TDK
TDK C Type 0201 series
Professional range of TDK multilayer ceramic chip capacitors. Through precision technologies, high capacitance is achieved. The capacitors incorporate a monolithic structure which ensures superior mechanical strength and reliability.
Features and Benefits:
Monolithic structure
Low ESL
Low self-heating and high ripple resistance
Low ESL
Low self-heating and high ripple resistance
Applications:
Suitable applications would include general electronic equipment, power supply circuits and office automation equipment.
Warning
Not Recommended for New Design. TDK recommend 1447335
0201 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn)
Applications include mobile phones, video and tuner designs
C0G/NP0 is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials
X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials
Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
Applications include mobile phones, video and tuner designs
C0G/NP0 is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials
X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials
Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.