Phoenix Contact MCDNV Series Vertical Through Hole PCB Header, 8 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

Subtotal (1 pack of 75 units)*

$705.49

(exc. GST)

$811.31

(inc. GST)

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from 19 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s)
Per Pack
Per unit*
1 +$705.49$9.407

*price indicative

RS Stock No.:
483-454
Mfr. Part No.:
1952801
Brand:
Phoenix Contact
Find similar products by selecting one or more attributes.
Select all

Brand

Phoenix Contact

Series

MCDNV

Product Type

PCB Header

Pitch

3.5mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

8

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Tin over Nickel

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

3.5mm

Tail Pin Length

2.6mm

Maximum Operating Temperature

100°C

Contact Gender

Male

Mating Pin Length

2.6mm

Standards/Approvals

cULus Recognised, VDE approval

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header is designed to deliver superior performance for electronic applications, particularly in environments requiring through-hole reflow technology. Crafted to provide flexibility and ease of integration, it supports multi-row arrangements on the PCB with its vertical connection design. The component offers an exceptional conductor connection across several levels, significantly enhancing contact density and allowing for diverse device configurations. Its robust construction, featuring a black LCP housing and durable Cu alloy contacts with tin plating, promises reliability and compliance with strict environmental standards such as RoHS and WEEE directives. Users will appreciate its compatibility with a range of connection technologies and its optimised soldering capabilities, making it a dependable choice for modern electronics assembly.

Designed for seamless integration into SMT soldering processes

Facilitates multi-row arrangements, enhancing space utilisation

Supports various connection technologies for maximum design flexibility

Optimised for higher contact density, contributing to improved overall performance

Complies with RoHS and WEEE standards, ensuring environmental responsibility

Robust construction provides longevity and reliability in diverse applications

Simplifies assembly with straightforward soldering methods

Pin layout is geared for standardised PCB designs, enhancing compatibility

Related links