Molex 21657 Series Vertical Through Hole PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Bulk discount available

Subtotal (1 pack of 5 units)*

$15.96

(exc. VAT)

$18.35

(inc. VAT)

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  • Plus 42 unit(s) shipping from 15 December 2025
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Pack(s)
Per Pack
Per unit*
1 - 4$15.96$3.192
5 - 9$14.67$2.934
10 +$13.23$2.646

*price indicative

RS Stock No.:
536-866
Mfr. Part No.:
2165711032
Brand:
Molex
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Brand

Molex

Product Type

PCB Header

Series

21657

Pitch

3mm

Current

13A

Number of Contacts

2

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Power, Wire-to-Board

Mount Type

Through Hole

Contact Plating

Matt Tin

Contact Material

High Copper Alloy

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Tail Pin Length

3.18mm

Contact Gender

Female

Maximum Operating Temperature

125°C

Standards/Approvals

No

Voltage

600 Vrms

COO (Country of Origin):
CN
The Molex Micro fit+ versa colour vertical header is designed to streamline connections with its innovative 3.00mm pitch. This component ensures efficient power distribution through reliable, two circuit connections. Its robust construction features a matte tin plating, enhancing durability and resistance to wear. Capable of withstanding extreme temperatures, the product operates effectively in challenging environments. The precision engineering allows for keying with mating parts, preventing misalignment and ensuring reliable connections every time. Ideal for applications requiring secure wire to board connections, this header not only enhances performance but also supports a cleaner, clutter free design in your electronic projects.

Offers a reliable interface for power and signal connections

Designed specifically for high performance applications

Facilitates easy locking with mating parts for enhanced security

Constructed with low halogen materials contributing to environmental sustainability

Optimised for vertical orientation reducing footprint in confined spaces

Supports a broad temperature range for versatile usage

Features pcb retention to ensure stability during operation

Facilitates a high mating cycle durability for extended use

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