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MPN

Molex, Micro-Fit 3.0, 43650, 6 Way, 1 Row, Straight PCB Header

This image is representative of the product range


55 In stock for delivery within 7 working day(s)
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Price (ex. GST) Each (In a Pack of 5)

$2.23

(exc. GST)

$2.56

(inc. GST)

units

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Packaging Options:
RS Stock No.:
447-6928
Mfr. Part No.:
43650-0615
Manufacturer:
Molex
COO (Country of Origin):
US
unitsPer unitPer Pack*
5 - 95$2.23$11.15
100 - 370$2.19$10.95
375 - 1495$2.108$10.54
1500 - 2995$2.064$10.32
3000 +$2.028$10.14
*price indicative

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


Features and Benefits


• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

• Kinked solder legs for additional PCB retention

• Glow Wire Compliant


Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals


Molex Micro-Fit 3.0 Series

AttributeValue
SeriesMicro-Fit 3.0
Pitch3.0mm
Number of Contacts6
Number of Rows1
Body OrientationStraight
Shrouded/UnshroudedShrouded
Connector SystemWire to Board
Mounting TypeThrough Hole
Termination MethodSolder
Contact PlatingTin
Contact MaterialBrass
Current Rating5.0A