STMicroelectronics Demonstration Board for VNI8200XP for High Side Driver
- RS Stock No.:
- 196-1763
- Mfr. Part No.:
- STEVAL-IFP022V1
- Brand:
- STMicroelectronics
Bulk discount available
Subtotal (1 unit)*
$175.05
(exc. GST)
$201.31
(inc. GST)
FREE delivery for orders over $60.00 ex GST
Supply shortage
- Plus 3 left, shipping from 08 December 2025
Our current stock is limited and our suppliers are expecting shortages.
Units | Per unit |
|---|---|
| 1 - 4 | $175.05 |
| 5 + | $169.28 |
*price indicative
- RS Stock No.:
- 196-1763
- Mfr. Part No.:
- STEVAL-IFP022V1
- Brand:
- STMicroelectronics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| For Use With | High Side Driver | |
| Kit Classification | Evaluation Board | |
| Featured Device | VNI8200XP | |
| Kit Name | Demonstration Board | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
For Use With High Side Driver | ||
Kit Classification Evaluation Board | ||
Featured Device VNI8200XP | ||
Kit Name Demonstration Board | ||
- COO (Country of Origin):
- IT
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
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