STMicroelectronics Surface Chip Balun
- RS Stock No.:
- 190-6833P
- Mfr. Part No.:
- EMIF03-SIM02M8
- Brand:
- STMicroelectronics
Subtotal 25 units (supplied on a continuous strip)*
$15.23
(exc. GST)
$17.50
(inc. GST)
Spend over $80.00 ex GST for FREE delivery
In Stock
- Plus 1,950 unit(s) shipping from 12 October 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 25 + | $0.609 |
*price indicative
- RS Stock No.:
- 190-6833P
- Mfr. Part No.:
- EMIF03-SIM02M8
- Brand:
- STMicroelectronics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Product Type | Chip Balun | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Frequency | 3.0GHz | |
| Minimum Operating Temperature | -40°C | |
| Minimum Frequency | 300kHz | |
| Maximum Operating Temperature | 85°C | |
| Package Type | Micro QFN | |
| Length | 1.7mm | |
| Width | 1.5mm | |
| Series | EMIF03-SIM02M8 | |
| Standards/Approvals | UL94 V0, JEDEC JESD97, IEC 61000-4-2, MIL STD 883G | |
| Height | 0.6mm | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Product Type Chip Balun | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Frequency 3.0GHz | ||
Minimum Operating Temperature -40°C | ||
Minimum Frequency 300kHz | ||
Maximum Operating Temperature 85°C | ||
Package Type Micro QFN | ||
Length 1.7mm | ||
Width 1.5mm | ||
Series EMIF03-SIM02M8 | ||
Standards/Approvals UL94 V0, JEDEC JESD97, IEC 61000-4-2, MIL STD 883G | ||
Height 0.6mm | ||
- COO (Country of Origin):
- CN
The STMicroelectronics EMIF03-SIM02M8 is a 3 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the external pins.
High reduction of parasitic elements through integration and wafer level packaging
High reliability offered by monolithic integration
SIM card EMI low-pass filter
Very low PCB space consumption 1.7 mm x 1.5 mm
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