Infineon 6EDL04N03PRXUMA1 High Side Gate Driver 6, 165 mA 25-Pin 17.5 V, PG-TSSOP-25
- RS Stock No.:
- 351-978
- Mfr. Part No.:
- 6EDL04N03PRXUMA1
- Brand:
- Infineon
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$24.79
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$28.51
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Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 45 | $4.958 | $24.79 |
| 50 - 95 | $4.712 | $23.56 |
| 100 - 495 | $4.36 | $21.80 |
| 500 - 995 | $4.016 | $20.08 |
| 1000 + | $3.87 | $19.35 |
*price indicative
- RS Stock No.:
- 351-978
- Mfr. Part No.:
- 6EDL04N03PRXUMA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Gate Driver Module | |
| Output Current | 165mA | |
| Pin Count | 25 | |
| Package Type | PG-TSSOP-25 | |
| Fall Time | 26ns | |
| Driver Type | High Side | |
| Number of Outputs | 6 | |
| Rise Time | 100ns | |
| Minimum Supply Voltage | 10V | |
| Maximum Supply Voltage | 17.5V | |
| Number of Drivers | 6 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | JEDEC47/20/22 | |
| Series | 6EDL04 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Gate Driver Module | ||
Output Current 165mA | ||
Pin Count 25 | ||
Package Type PG-TSSOP-25 | ||
Fall Time 26ns | ||
Driver Type High Side | ||
Number of Outputs 6 | ||
Rise Time 100ns | ||
Minimum Supply Voltage 10V | ||
Maximum Supply Voltage 17.5V | ||
Number of Drivers 6 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals JEDEC47/20/22 | ||
Series 6EDL04 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- CN
The Infineon Three-phase gate driver 3rd generation is a full bridge driver to control power devices like MOS-transistors in 3-phase systems with a maximum blocking voltage. Based on the used SOI-technology there is an excellent ruggedness on transient voltages. No parasitic thyristor structures are present in the device. Hence, no parasitic latch-up may occur at all temperatures and voltage conditions
Smallest footprint package solution
Higher efficiency
Increased reliability
Higher breakdown voltage
Easy of design
Related links
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