Transcend mSATA 256 MB Internal SSD
- RS Stock No.:
- 683-088
- Mfr. Part No.:
- TS256GMSA470P
- Brand:
- Transcend
N
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$947.22
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$1,089.30
(inc. GST)
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- Plus 2 unit(s) shipping from 04 May 2026
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Units | Per unit |
|---|---|
| 1 + | $947.22 |
*price indicative
- RS Stock No.:
- 683-088
- Mfr. Part No.:
- TS256GMSA470P
- Brand:
- Transcend
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Transcend | |
| Product Type | SSD | |
| Sub Type | SSD | |
| Memory Size | 256MB | |
| Internal/External | Internal | |
| Form Factor | mSATA | |
| Industrial Grade | Yes | |
| NAND Type | 3D | |
| Interface Type | SATA III 6 Gb/S | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Width | 29.85mm | |
| Height | 4.85mm | |
| Length | 50.8mm | |
| Standards/Approvals | UKCA | |
| Select all | ||
|---|---|---|
Brand Transcend | ||
Product Type SSD | ||
Sub Type SSD | ||
Memory Size 256MB | ||
Internal/External Internal | ||
Form Factor mSATA | ||
Industrial Grade Yes | ||
NAND Type 3D | ||
Interface Type SATA III 6 Gb/S | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Width 29.85mm | ||
Height 4.85mm | ||
Length 50.8mm | ||
Standards/Approvals UKCA | ||
Transcend SSD, 256MB Memory size, 50.8mm Length - TS256GMSA470P
This mSATA SSD provides Compact internal storage for industrial computing and embedded systems, designed to operate in demanding environments. It connects via a SATA III 6Gb/s Interface and uses 3D NAND memory to deliver solid‑state data retention and responsiveness for automation and electronic control applications. It is specified for extended temperature ranges and conforms to UKCA standards for use in regulated installations.
Features and Benefits:
• 256MB memory size supports system buffer and caching needs
• Industrial‑grade construction enables sustained operation in harsh conditions
• Operating range from -40°C to 85°C maintains functionality across extremes
• SATA III 6Gb/s Interface delivers high‑throughput data transfer performance
• 3D NAND provides dependable solid‑state storage characteristics
• mSATA form factor delivers Compact internal deployment advantages
• Industrial‑grade construction enables sustained operation in harsh conditions
• Operating range from -40°C to 85°C maintains functionality across extremes
• SATA III 6Gb/s Interface delivers high‑throughput data transfer performance
• 3D NAND provides dependable solid‑state storage characteristics
• mSATA form factor delivers Compact internal deployment advantages
Applications
• Suitable for industrial controllers in factory automation systems
• Ideal for embedded electronics in transportation equipment
• Used with test rigs and instrumentation requiring rugged storage
• Can be used for data logging in harsh environmental monitoring
• Used for firmware and OS storage in Compact mechanical control units
• Ideal for embedded electronics in transportation equipment
• Used with test rigs and instrumentation requiring rugged storage
• Can be used for data logging in harsh environmental monitoring
• Used for firmware and OS storage in Compact mechanical control units
What form factor is provided for space‑constrained designs?
The drive uses an mSATA form factor intended for Compact internal installations where board‑level or small‑slot storage is required.
How does the device cope with temperature cycling in field equipment?
It is specified to operate continuously between -40°C and 85°C, supporting deployments exposed to wide thermal variation.
Which Interface should be used to connect this module?
Connect via a SATA III 6Gb/s link to host controllers or storage bridges that accept mSATA devices.
Is the product suitable for regulated UK installations?
It carries UKCA approval, indicating conformity with applicable UK regulatory marking requirements.
What NAND technology underpins the storage reliability?
The module utilises 3D NAND architecture to provide solid‑state cell layering for endurance and density.
