Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, SOP to DIP
- RS Stock No.:
- 741-9401
- Mfr. Part No.:
- W9503-2RC
- Brand:
- Winslow
Bulk discount available
Subtotal (1 pack of 5 units)*
$155.01
(exc. GST)
$178.26
(inc. GST)
FREE delivery for orders over $60.00 ex GST
In Stock
- Plus 20 unit(s) shipping from 23 February 2026
- Plus 150 unit(s) shipping from 19 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 370 | $31.002 | $155.01 |
| 375 - 1995 | $29.914 | $149.57 |
| 2000 + | $28.518 | $142.59 |
*price indicative
- RS Stock No.:
- 741-9401
- Mfr. Part No.:
- W9503-2RC
- Brand:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | SOP | |
| Connection Gender A | Female | |
| Number of Contacts A | 16 | |
| Number of Contacts B | 16 | |
| Connection Gender B | Male | |
| Pitch | 2.54mm | |
| Connection B | DIP | |
| Contact Plating | Tin over Nickel | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A SOP | ||
Connection Gender A Female | ||
Number of Contacts A 16 | ||
Number of Contacts B 16 | ||
Connection Gender B Male | ||
Pitch 2.54mm | ||
Connection B DIP | ||
Contact Plating Tin over Nickel | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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