Infineon HEXFET N-Channel MOSFET, 42 A, 100 V Enhancement, 3-Pin TO-263

RS Stock No.:: 215-2572P
Mfr. Part No.:: IRF1310NSTRLPBF
Brand:: Infineon

Infineon HEXFET N-Channel MOSFET, 42 A, 100 V Enhancement, 3-Pin TO-263

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RS Stock No.:: 215-2572P
Mfr. Part No.:: IRF1310NSTRLPBF
Brand:: Infineon

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Infineon
	Product Type	MOSFET
	Channel Type	N
	Maximum Continuous Drain Current Id	42A
	Maximum Drain Source Voltage Vds	100V
	Series	HEXFET
	Package Type	TO-263
	Mount Type	Surface
	Pin Count	3
	Maximum Drain Source Resistance Rds	36mΩ
	Channel Mode	Enhancement
	Forward Voltage Vf	1.3V
	Maximum Gate Source Voltage Vgs	20V
	Typical Gate Charge Qg @ Vgs	110nC
	Minimum Operating Temperature	-55°C
	Maximum Power Dissipation Pd	160W
	Maximum Operating Temperature	175°C
	Standards/Approvals	EIA 418
	Height	1.197in
	Width	1.079in
	Length	14.173in
	Automotive Standard	No

	Select all
	Brand Infineon
	Product Type MOSFET
	Channel Type N
	Maximum Continuous Drain Current Id 42A
	Maximum Drain Source Voltage Vds 100V
	Series HEXFET
	Package Type TO-263
	Mount Type Surface
	Pin Count 3
	Maximum Drain Source Resistance Rds 36mΩ
	Channel Mode Enhancement
	Forward Voltage Vf 1.3V
	Maximum Gate Source Voltage Vgs 20V
	Typical Gate Charge Qg @ Vgs 110nC
	Minimum Operating Temperature -55°C
	Maximum Power Dissipation Pd 160W
	Maximum Operating Temperature 175°C
	Standards/Approvals EIA 418
	Height 1.197in
	Width 1.079in
	Length 14.173in
	Automotive Standard No

Datasheet - IRF1310NSTRLPBF

The Infineon series fifth generation HEXFET from International rectifier utilize advanced processing techniques to achieve extremely low on resistance for Silicon area. This benefits, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFET are well known for, providing sufficient level device for, provides designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2pack is a surface mount power package capable of accommodating die sizes upto HEX-4. It provide the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2pack is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.

Advanced Process Technology

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