Infineon HEXFET N-Channel MOSFET, 33 A, 100 V Enhancement, 3-Pin TO-263

RS Stock No.:: 831-2831P
Mfr. Part No.:: IRF540NSTRLPBF
Brand:: Infineon

Infineon HEXFET N-Channel MOSFET, 33 A, 100 V Enhancement, 3-Pin TO-263

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RS Stock No.:: 831-2831P
Mfr. Part No.:: IRF540NSTRLPBF
Brand:: Infineon

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Infineon
	Channel Type	N
	Product Type	MOSFET
	Maximum Continuous Drain Current Id	33A
	Maximum Drain Source Voltage Vds	100V
	Package Type	TO-263
	Series	HEXFET
	Mount Type	Surface
	Pin Count	3
	Maximum Drain Source Resistance Rds	44mΩ
	Channel Mode	Enhancement
	Maximum Power Dissipation Pd	130W
	Minimum Operating Temperature	-55°C
	Typical Gate Charge Qg @ Vgs	71nC
	Forward Voltage Vf	1.2V
	Maximum Gate Source Voltage Vgs	-20V, +20V
	Maximum Operating Temperature	175°C
	Width	9.65mm
	Standards/Approvals	No
	Height	4.83mm
	Length	10.67mm
	Automotive Standard	No

	Select all
	Brand Infineon
	Channel Type N
	Product Type MOSFET
	Maximum Continuous Drain Current Id 33A
	Maximum Drain Source Voltage Vds 100V
	Package Type TO-263
	Series HEXFET
	Mount Type Surface
	Pin Count 3
	Maximum Drain Source Resistance Rds 44mΩ
	Channel Mode Enhancement
	Maximum Power Dissipation Pd 130W
	Minimum Operating Temperature -55°C
	Typical Gate Charge Qg @ Vgs 71nC
	Forward Voltage Vf 1.2V
	Maximum Gate Source Voltage Vgs -20V, +20V
	Maximum Operating Temperature 175°C
	Width 9.65mm
	Standards/Approvals No
	Height 4.83mm
	Length 10.67mm
	Automotive Standard No

Infineon HEXFET Series MOSFET, 33A Maximum Continuous Drain Current, 130W Maximum Power Dissipation - IRF540NSTRLPBF

This high power MOSFET is designed for efficiency and reliability across a variety of applications. Featuring an N-channel configuration, it operates in enhancement mode with a maximum continuous drain current of 33A and a breakdown voltage of 100V. Its surface mount design allows for simple integration into printed circuit boards, enhancing versatility in modern applications.