Phoenix Contact IPCV Series Wave Soldering Mount PCB Header, 8 Contact(s), 10.16 mm Pitch, 1 Row, Shrouded

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Subtotal (1 pack of 50 units)*

$3,683.65

(exc. GST)

$4,236.20

(inc. GST)

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RS Stock No.:
496-948
Mfr. Part No.:
1969755
Brand:
Phoenix Contact
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Brand

Phoenix Contact

Series

IPCV

Product Type

PCB Header

Pitch

10.16mm

Current

76A

Housing Material

Polyamide

Number of Contacts

8

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON PC 6 hybrid

Contact Material

Copper Alloy

Contact Plating

Silver

Row Pitch

10.16mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Maximum Operating Temperature

100°C

Tail Pin Length

4mm

Contact Gender

Female

Mating Pin Length

4mm

Standards/Approvals

cULus Recognised, EN 60695-10-2, EN 60695-2-12, EN 60695-2-13, IEC 60068-2-70, IEC 60068-2-82, IEC 60112, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-3-1, IEC 60512-5-1, IEC 60512-7, IEC 60512-8, IEC 60664-1, IEC 61984, ISO 6988, JEDEC JESD 201, REACH, RoHS, UL 94, VDE approval

Voltage

1000 V

COO (Country of Origin):
PL
The Phoenix Contact PCB header, designed within the IPCV range, epitomises versatility and reliability for electronic connections. Tailored for seamless integration, it offers a compact solution with linear pinning and a pitch of 10.16 mm, ensuring easy installations. Its robust construction is complemented by the electroplated silver surface that enhances conductivity and resilience, providing secure connections for longevity. With a distinctive inverted design, it not only meets rigorous industry standards but also offers touch-proof device outputs, enhancing the safety of your applications. The header is engineered to handle demanding tasks, featuring a nominal current capacity of 76 A and a rated voltage of 1000 V. This product is particularly suited for wave soldering processes, making it an ideal choice for manufacturers looking to streamline their assembly lines.

Designed for easy integration and reliable performance

Inverted design for added safety in device output connections

Electroplated silver surface for improved conductivity

Supports wave soldering for efficient assembly

Robust construction ensures durability under varying conditions

Optimised for use with a variety of connection technologies

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