Molex 21575 Series Vertical Wire PCB Header, 3 Contact(s), 4 mm Pitch, 1 Row(s), Shrouded

Bulk discount available

Subtotal (1 pack of 10 units)*

$16.73

(exc. GST)

$19.24

(inc. GST)

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  • 20 unit(s) ready to ship from another location
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Pack(s)
Per Pack
Per unit*
1 - 4$16.73$1.673
5 - 9$15.38$1.538
10 +$13.89$1.389

*price indicative

RS Stock No.:
536-202
Mfr. Part No.:
2157591024
Brand:
Molex
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Brand

Molex

Product Type

PCB Header

Series

21575

Pitch

4mm

Number of Contacts

3

Housing Material

Nylon

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Wire

Connector System

Power, Wire-to-Board, Wire-to-Wire

Termination Type

Crimp

Row Pitch

4mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Contact Gender

Female

Standards/Approvals

Compliant per EU 2015/863 chemSHERPA (xml) IPC 1752A Class D Molex Product Compliance Declaration, Eu RoHS REACH SVHC Low-Halogen, IEC-62474, IPC 1752A Class C

COO (Country of Origin):
CN
The Molex Micro fit+ versa Color Receptacle Housing delivers exceptional performance in a compact design, ideal for power and wire to board or wire to wire applications. With its unique single row configuration and four circuit design, it is engineered for rigorous environments, meeting the highest safety standards. The housing is crafted from durable nylon material, ensuring resilience against wear and tear while providing glow wire capability for enhanced safety. This connector is not just practical; it's designed to seamlessly integrate with various headers and terminals, allowing for flexible and reliable connectivity. Its vibrant red colour not only adds a visual cue for easy identification but also signifies quality and compliance, making it an indispensable choice for modern electrical systems.

Constructed from robust nylon for durability

Designed for compatibility with multiple male headers

Ensures reliable connections with enhanced glow wire safety

Lightweight design promotes easier installation and integration

Offers an efficient solution for compact electronic assemblies

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