Molex 171856 Series Vertical Through Hole PCB Header, 3 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded
- RS Stock No.:
- 788-321
- Mfr. Part No.:
- 171856-1003
- Brand:
- Molex
N
Subtotal (1 bag of 600 units)*
$732.82
(exc. GST)
$842.74
(inc. GST)
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Bag(s) | Per Bag | Per unit* |
|---|---|---|
| 1 + | $732.82 | $1.221 |
*price indicative
- RS Stock No.:
- 788-321
- Mfr. Part No.:
- 171856-1003
- Brand:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 171856 | |
| Pitch | 2.54mm | |
| Current | 4A | |
| Number of Contacts | 3 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Voltage | 500V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 171856 | ||
Pitch 2.54mm | ||
Current 4A | ||
Number of Contacts 3 | ||
Housing Material Thermoplastic | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
Voltage 500V | ||
- COO (Country of Origin):
- IN
The Molex PCB header is designed for seamless connection between printed circuit boards, ensuring robust performance in various applications. Its versatility makes it essential for efficient electrical connections in complex systems.
Offers reliable board-to-board connection to enhance system integrity
Utilises high-speed internal I/O technology to optimise data transfer
Features a Compact design that supports space-saving system architecture
Built to meet demanding industrial standards for superior durability
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