Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

RS Stock No.:: 233-2955P
Mfr. Part No.:: 43045-0400
Brand:: Molex

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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RS Stock No.:: 233-2955P
Mfr. Part No.:: 43045-0400
Brand:: Molex

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Molex
	Product Type	PCB Header
	Series	Micro-Fit 3.0
	Pitch	3mm
	Current	5A
	Number of Contacts	4
	Housing Material	Thermoplastic
	Number of Rows	2
	Orientation	Right Angle
	Shrouded/Unshrouded	Shrouded
	Mount Type	Through Hole
	Connector System	Wire-to-Board
	Contact Plating	Tin
	Contact Material	Brass
	Termination Type	Solder
	Row Pitch	3mm
	Minimum Operating Temperature	-40°C
	Contact Gender	Male
	Maximum Operating Temperature	105°C
	Standards/Approvals	No
	Mating Pin Length	3mm
	Voltage	250V

	Select all
	Brand Molex
	Product Type PCB Header
	Series Micro-Fit 3.0
	Pitch 3mm
	Current 5A
	Number of Contacts 4
	Housing Material Thermoplastic
	Number of Rows 2
	Orientation Right Angle
	Shrouded/Unshrouded Shrouded
	Mount Type Through Hole
	Connector System Wire-to-Board
	Contact Plating Tin
	Contact Material Brass
	Termination Type Solder
	Row Pitch 3mm
	Minimum Operating Temperature -40°C
	Contact Gender Male
	Maximum Operating Temperature 105°C
	Standards/Approvals No
	Mating Pin Length 3mm
	Voltage 250V

Molex Right Angle PCB Header, 4 Way, 2 Rows - Micro-Fit 3.0 Series - 43045-0400

This header from Molex's Micro-Fit 3.0 series has a right-angled orientation to save space on your PCB (printed circuit board) and reduce strain on cables. It's a reliable and compact 4-way header with a 3.0mm pitch and is used in low-range to mid-range power distribution. The housing is made from a high-temperature liquid crystal polymer that's able to handle the high temperatures (up to +265°C) that occur during the infra-red reflow soldering process. The contacts are fully isolated inside the housing to reduce arcing.

Features & Benefits

• Locking ramps on the housing offer positive latching to prevent accidental disconnection

• Tin-plated contacts resist corrosion to ensure excellent conductivity and reliable data transfer

• Plastic peg PCB locks make a secure connection to the PCB

• Through-hole mounting and solder termination make a strong connection with the board

Applications

• Data communications

• Solar power installations

• Gaming terminals

What's the Molex Micro-Fit system?

Molex's Micro-Fit system is a compact and versatile series of connectors available in multiple circuit sizes and cable lengths. These components are used for board-to-board, wire-to-board and wire-to-wire configurations.

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits

• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals