Infineon OptiMOS 2 Type N-Channel MOSFET, 1.4 A, 30 V Enhancement, 3-Pin SOT-23
- RS Stock No.:
- 826-9412
- Mfr. Part No.:
- BSS316NH6327XTSA1
- Brand:
- Infineon
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Units | Per unit | Per Reel* |
|---|---|---|
| 250 - 500 | $0.303 | $75.75 |
| 750 - 1250 | $0.295 | $73.75 |
| 1500 + | $0.291 | $72.75 |
*price indicative
- RS Stock No.:
- 826-9412
- Mfr. Part No.:
- BSS316NH6327XTSA1
- Brand:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 1.4A | |
| Maximum Drain Source Voltage Vds | 30V | |
| Package Type | SOT-23 | |
| Series | OptiMOS 2 | |
| Mount Type | Surface | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance Rds | 280mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Maximum Power Dissipation Pd | 500mW | |
| Typical Gate Charge Qg @ Vgs | 0.6nC | |
| Forward Voltage Vf | 0.8V | |
| Maximum Operating Temperature | 150°C | |
| Length | 2.9mm | |
| Height | 0.9mm | |
| Standards/Approvals | No | |
| Automotive Standard | AEC-Q101 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 1.4A | ||
Maximum Drain Source Voltage Vds 30V | ||
Package Type SOT-23 | ||
Series OptiMOS 2 | ||
Mount Type Surface | ||
Pin Count 3 | ||
Maximum Drain Source Resistance Rds 280mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Maximum Power Dissipation Pd 500mW | ||
Typical Gate Charge Qg @ Vgs 0.6nC | ||
Forward Voltage Vf 0.8V | ||
Maximum Operating Temperature 150°C | ||
Length 2.9mm | ||
Height 0.9mm | ||
Standards/Approvals No | ||
Automotive Standard AEC-Q101 | ||
Infineon OptiMOS 2 Series MOSFET, 30V Maximum Drain Source Voltage, 1.4A Maximum Continuous Drain Current - BSS316NH6327XTSA1
This n-channel MOSFET is a surface-mount switching transistor designed for low-voltage power management in compact electronic assemblies. It operates as an enhancement-mode device suitable for switching and control tasks in automotive and industrial contexts, with a gate-source voltage rating that enables robust drive margins for typical control circuits.
Features and Benefits:
• Low on-resistance delivers efficient conduction and reduced losses
• 30V drain-source rating supports common low-voltage systems
• 1.4A continuous current capability handles moderate loads
• 0.6nC typical gate charge enables fast switching transitions
• 500mW maximum power dissipation suits tight thermal budgets
• AEC‑Q101 qualification provides automotive-grade reliability criteria
• 30V drain-source rating supports common low-voltage systems
• 1.4A continuous current capability handles moderate loads
• 0.6nC typical gate charge enables fast switching transitions
• 500mW maximum power dissipation suits tight thermal budgets
• AEC‑Q101 qualification provides automotive-grade reliability criteria
Applications
• Suitable for low-voltage automotive load switching
• Ideal for point-of-load conversion in compact electronics
• Used with battery-powered systems requiring small form factor
• Can be used for motor-drive gate control in small actuators
• Suitable for power management on densely populated boards
• Ideal for point-of-load conversion in compact electronics
• Used with battery-powered systems requiring small form factor
• Can be used for motor-drive gate control in small actuators
• Suitable for power management on densely populated boards
What thermal range can it withstand during operation?
It is specified to operate from -55°C up to 150°C, allowing use across wide temperature environments.
How many electrical connections does it present to the board?
It uses a three-pin configuration compatible with standard SOT-23 land patterns for surface mounting.
What maximum voltage should be applied between gate and source?
The gate-to-source rating is 20V, which defines the safe maximum gate-drive amplitude.
What package height and footprint considerations affect layout?
The package has a low profile with a height of 0.9mm and rectangular footprint sizing of 2.9x1.3mm for compact PCB designs.
Related links
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