Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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Subtotal (1 pack of 5 units)*

$12.87

(exc. GST)

$14.80

(inc. GST)

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In Stock
  • 40 unit(s) ready to ship from another location
  • Plus 50 unit(s) shipping from 04 June 2026
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Units
Per unit
Per Pack*
5 - 120$2.574$12.87
125 - 495$2.544$12.72
500 - 2495$2.446$12.23
2500 - 4995$2.372$11.86
5000 +$2.32$11.60

*price indicative

Packaging Options:
RS Stock No.:
670-4742
Mfr. Part No.:
43650-0401
Brand:
Molex
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Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Housing Material

Thermoplastic

Number of Contacts

4

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Voltage

250V

COO (Country of Origin):
MX

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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